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FPF1003-FPF1004 IntelliMAXTM Advanced Load Management Products
April 2007
FPF1003-FPF1004 IntelliMAXTM Advanced Load Management Products
Features
1.2 to 5.5V Input Voltage Range RDS(ON) = 30 m @ VIN = 5.5V RDS(ON) = 35 m @ VIN = 3.3V ESD Protected, above 2000V HBM
tm
General Description
The FPF1003 & FPF1004 are low RDS P-Channel MOSFET load switches with controlled turn-on. The input voltage range operates from 1.2V to 5.5V to fulfill today's Ultra Portable Device's supply requirement. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. In FPF1004, 120 on-chip load resistor is added for output quick discharge when switch is turned off. Both FPF1003 & FPF1004 are available in a space-saving 1.0x1.5 mm2 chip scale package, 1.0X1.5CSP-6.
Applications
PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Hot Swap Supplies RoHS Compliant
Pin 1
VIN VIN ON GND VOUT VOUT
BOTTOM
TOP
Typical Application Circuit
TO LOAD VIN VOUT
FPF1003/4 OFF ON ON GND
Ordering Information
Part
FPF1003 FPF1004
Switch
30m, PMOS 30m, PMOS
Input buffer
Schmitt Schmitt
Output Discharge
NA 120 1
ON Pin Activity
Active HI Active HI
Top Mark
3 4
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(c)2006 Fairchild Semiconductor Corporation FPF1003-FPF1004 Rev. H
FPF1003-FPF1004 IntelliMAXTM Advanced Load Management Products
Functional Block Diagram
VIN Turn-On Slew Rate Controlled Driver CONTROL LOGIC
ON
ESD protection VOUT
FPF1003/4
Output Discharge (Optional)
GND
Pin Configuration
A2 A1
B2
B1
C2
C1
1.0 x 1.5 CSP Bottom View
Pin Description
Pin
A2, B2 C2 A1, B1 C1
Name
VIN ON VOUT GND ON Control Input
Function
Supply Input: Input to the power switch and the supply voltage for the IC Switch Output: Output of the power switch Ground
FPF1003-FPF1004 Rev. H
2
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FPF1003-FPF1004 IntelliMAXTM Advanced Load Management Products
Absolute Maximum Ratings
Parameter
VIN, VOUT, ON to GND Power Dissipation @ TA = 25C (Note 1) Maximum Continuous Switch Current Operating Temperature Range Storage Temperature Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM MM 2000 200 -40 -65
Min
-0.3
Max
6 1.2 2.0 125 150 85
Unit
V W A C C C/W V V
Recommended Operating Range
Parameter
VIN Ambient Operating Temperature, TA
Min
1.2 -40
Max
5.5 85
Unit
V C
Electrical Characteristics
VIN = 1.2 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25C.
Parameter
Basic Operation Operating Voltage Quiescent Current Off Supply Current Off Switch Current
Symbol
VIN IQ IQ(off) ISD(off)
Conditions
Min
1.2
Typ
Max
5.5 1 1 1
Units
V A A A nA
IOUT = 0mA, VIN = Von VON = GND, OUT = open VON = GND, VOUT = 0 @ VIN = 5.5V, TA = 85C VON = GND, VOUT = 0 @ VIN = 3.3V, TA = 25C VIN = 5.5V, TA = 25C VIN = 3.3V, TA = 25C VIN = 1.5V, TA = 25C VIN = 1.2V, TA = 25C VIN = 3.3V, VON = 0V, TA = 25C, FPF1004 VIN = 2.7V to 5.5V VIN = 1.2V VIN = 2.7V to 5.5V VIN = 1.2V VON = VIN or GND 2 0.8 10 20 25 50 95 75
100 30 35 75 150 120
On-Resistance
RON
m
Output Pull Down Resistance ON Input Logic High Voltage ON Input Logic Low Voltage ON Input Leakage Dynamic Turn on delay
RPD VIH VIL
V
0.8 0.35 1 13 45 15 13 113 10
V A s s s s s s
tON
VIN = 3.3V, RL = 500, CL = 0.1uF, TA = 25C VIN = 3.3V, RL = 500, CL = 0.1uF, TA = 25C, FPF1003 VIN = 3.3V, RL = 500, CL = 0.1uF, RL_CHIP = 120, TA = 25C, FPF1004 VIN = 3.3V, RL = 500, CL = 0.1uF, TA = 25C VIN = 3.3V, RL = 500, CL = 0.1uF, TA = 25C, FPF1003 VIN = 3.3V, RL = 500, CL = 0.1uF, RL_CHIP = 120, TA = 25C, FPF1004
Turn off delay
tOFF
VOUT Rise Time
tR
VOUT Fall Time
tF
Note 1: Package power dissipation on 1square inch pad, 2 oz. copper board.
FPF1003-FPF1004 Rev. H
3
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FPF1003-FPF1004 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
10
2.5
8 SUPPLY CURRENT (nA)
2.0 ON THRESHOLD (V)
MAX LIMIT
6
1.5
TYPICAL
4
VON = VIN
1.0
2 VON = 0V 0 1 2 3 4 5 6 7 SUPPLY VOLTAGE (V) 8 9 10
0.5
0.0 1 2 3 4 SUPPLY VOLTAGE (V) 5 6
Figure 1. Quiescent Current vs.VIN
Figure 2. ON Threshold vs. VIN
16 14 SUPPLY CURRENT (nA)
SUPPLY CURRENT (nA)
10
12 10 8 6 4 2 0 -40
VIN = 5.5V
8
6
VIN = 5.5V
4
2
VIN = 3.3V
VIN = 3.3V
0
-15
10 35 60 TJ, JUNCTION TEMPERATURE (oC)
85
-40
-15
10 35 60 o TJ, JUNCTION TEMPERATURE ( C)
85
Figure 3. Quiescent Current vs. Temperature
Figure 4. Quiescent Current (off) vs. Temperature
1600 1400 SUPPLY CURRENT (nA) 1200 1000 800 600 400 200 0 -50
VIN = 3.3V
160 140 SUPPLY CURRENT (nA) 120 100 80 60 40 20 0
-25 0 25 50 o TJ, JUNCTION TEMPERATURE ( C) 75 100
VIN = 5.5V
1
2
3 4 SUPPLY VOLTAGE (V)
5
6
Figure 5. ISWITCH-OFF Current vs. Temperature
Figure 6. ISWITCH-OFF Current vs. VIN
FPF1003-FPF1004 Rev. H
4
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FPF1003-FPF1004 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
250
IOUT = 1A
1.5
VIN = 3.3V IOUT = 1A
ON RESISTANCE (mOhms)
RON NORMALIZED, (mOhms)
200
1.3
150
1.1
100
0.9
50
0.7
0 0 1 2 3 4 SUPPLY VOLTAGE (V) 5 6 7
0.5 -50
-25
0 25 50 TJ, JUNCTION TEMPERATURE (oC)
75
100
Figure 7. RON vs. VIN
Figure 8. RON vs. Temperature
100
VIN = 3.3V RL = 500 RL_CHIP = 120, FPF1004 RISE / FALL TIME (uS) CL = 0.1uF FPF1003 TOFF
1000 VIN = 3.3V RL = 500 RL_CHIP = 120, FPF1004 100 CL = 0.1uF FPF1003 TFALL TRISE 10 FPF1004 TFALL
TURN ON/OFF TIME (uS)
FPF1004 TOFF
TON
10 -50 -25 0 25 50 75 TJ, JUNCTION TEMPERATURE (oC) 100
1 -50 -25 0 25 50 75 TJ, JUNCTION TEMPERATURE (oC) 100
Figure 9. TON/TOff vs. Temperature
Figure 10. TRISE/TFALL vs. Temperature
VON 2V/DIV
VIN=3.3V CIN=1F COUT=0.1F RL=500
VON 2V/DIV
VIN=3.3V CIN=1F COUT=0.1F RL=500
IOUT 10mA/DIV
IOUT 10mA/DIV
VOUT 2V/DIV
VOUT 2V/DIV
50s/DIV Figure 11. FPF1003 TON Response
FPF1003-FPF1004 Rev. H
50s/DIV Figure 12. FPF1003 TOFF Response 5
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FPF1003-FPF1004 IntelliMAXTM Advanced Load Management Products
Typical Characteristics
VIN=3.3V CIN=1F COUT=0.1F RL=10 VIN=3.3V CIN=1F COUT=0.1F RL=10
VON 2V/DIV
VON 2V/DIV
IOUT 200mA/DIV
IOUT 200mA/DIV
VOUT 2V/DIV
VOUT 2V/DIV
50s/DIV Figure 13. FPF1003 TON Response
2s/DIV Figure 14. FPF1003 TOFF Response
VON 2V/DIV
VIN=3.3V CIN=1F COUT=0.1F RL=500
VON 2V/DIV
VIN=3.3V CIN=1F COUT=0.1F RL=500
IOUT 10mA/DIV
IOUT 10mA/DIV
VOUT 2V/DIV
VOUT 2V/DIV
50s/DIV Figure 15. FPF1004 TON Response
50s/DIV Figure 16. FPF1004 TOFF Response
VON 2V/DIV
VON 2V/DIV
IOUT 200mA/DIV
VOUT 2V/DIV
VIN=3.3V CIN=1F COUT=0.1F RL=10
IOUT 200mA/DIV
VOUT 2V/DIV
VIN=3.3V CIN=1F COUT=0.1F RL=10
50s/DIV Figure 17. FPF1004 TON Response
2s/DIV Figure 18. FPF1004 TOFF Response
FPF1003-FPF1004 Rev. H
6
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FPF1003-FPF1004 IntelliMAXTM Advanced Load Management Products
Description of Operation
The FPF1003 & FPF1004 are low RDS(ON) P-Channel load switches with controlled turn-on. The core of each device is a 30m P-Channel MOSFET and a controller capable of functioning over a wide input operating range of 1.2-5.5V. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. In FPF1004, 120 on-chip load resistor is added for output quick discharge when switch is turned off.
Application Information
Typical Application
TO LOAD VIN Battery 1.2V-5.5V VOUT
FPF1003/4 OFF ON C1 = 1F ON GND C2 = 0.1F R1 = 499
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1F ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance.
Output Capacitor
A 0.1F capacitor, COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductance from forcing VOUT below GND when the switch turns-off. Due to the integral body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN.
FPF1003-FPF1004 Rev. H
7
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FPF1003-FPF1004 IntelliMAXTM Advanced Load Management Products
Dimensional Outline and Pad Layout
1 .0 0 .1 0 IN D E X SLO T OUT
1 A
2
IN
0 .5 0 1 .5 0 0 .1 0 O 0 .2 5
B C
GND ON 0 .5 0 RECOMMENDED LAND PATTERN
1 .0 0
T O P V IE W
0 .6 5 M A X
O 0 .3 0
2 A
1
IN D E X SLO T
0 .5 0 0 .2 8 0 .2 2 S ID E V IE W SO LDER BALL
B C
1 .0 0
0 .5 0 B O T T O M V IE W
NOTES: A ) A L L D IM E N S IO N S A R E IN M IL L IM E T E R S .
FPF1003-FPF1004 Rev. H
8
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FPF1003-FPF1004 IntelliMAXTM Advanced Load Management Products
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx(R) Across the board. Around the world.TM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM CTLTM Current Transfer LogicTM DOMETM E2CMOSTM EcoSPARK(R) EnSignaTM FACT Quiet SeriesTM FACT(R) FAST(R) FASTrTM FPSTM FRFET(R) GlobalOptoisolatorTM GTOTM HiSeCTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM MICROCOUPLERTM MicroPakTM MICROWIRETM Motion-SPMTM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANAR(R) PACMANTM PDP-SPMTM POPTM Power220(R) Power247(R) PowerEdgeTM PowerSaverTM Power-SPMTM PowerTrench(R) Programmable Active DroopTM QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM ScalarPumpTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM The Power Franchise(R) TM TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyWireTM TruTranslationTM SerDesTM UHC(R) UniFETTM VCXTM WireTM
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I26
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
FPF1003-FPF1004 Rev. H
9
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